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Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series) - Tapa blanda

Du, Xiong; Zhang, Jun; Li, Gaoxian; Yu, Yaoyi; Qian, Cheng; Du, Rui

 
9789811931345: Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (CPSS Power Electronics Series)
Tapa blanda
ISBN 10: 9811931348 ISBN 13: 9789811931345
Editorial: Springer-Verlag GmbH, 2023

Sinopsis

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.

"Sinopsis" puede pertenecer a otra edición de este libro.

Acerca del autor

Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008.
Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.

De la contraportada

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Springer-Verlag GmbH
Año de publicación
2023
Idioma
Inglés
ISBN 10 
9811931348
ISBN 13 
9789811931345
Encuadernación
Tapa blanda
Número de edición
1
Número de páginas
188
Contacto del fabricante
no disponible
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