先进电子封装技术与关键材料丛书--微电子封装和集成的建模与仿真（英文版） - Tapa dura

Advanced Electronic Packaging Technology and Key Materials Series--Modeling and Simulation of Microelectronic Packaging and Integration (English version)(Chinese Edition)

Hardcover. Condición: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and . Nº de ref. del artículo: AMZ012358_NX046087_012358

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