9787122392275 - 先进电子封装技术与关键材料丛书--微电子封装和集成的建模与仿真（英文版） (2 resultados)
- Tapa dura
Librería: liu xing, Nanjing, JS, Chinaliu xing
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 443,55
Envío por EUR 15,55Se envía de China a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protect…ion) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .
- Tapa dura
Librería: liu xing, Nanjing, JS, Chinaliu xing
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 443,55
Envío por EUR 15,55Se envía de China a Estados Unidos de AmericaCantidad disponible: 3 disponibles
Hardcover. Condición: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protect…ion) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .
