低维形态样品组合材料芯片高通量制备技术与示范应用 - Tapa blanda

High-throughput preparation technology and demonstration application of low-dimensional morphological sample combination material chip(Chinese Edition)

paperback. Condición: New. Language:Chinese.Paperback. Pub Date: 2023-09 Pages: 480 Publisher: Science Press This book focuses on the high-throughput preparation technology and application demonstration of thin film. thick film and powder sample combination material chips. The content is based on the national key R&D plan project Key technologies and equipment for high-throughput preparation and rapid screening of low-dimensional combination material chips (2016YFB0700200). and at the same time adds research progress. . Nº de ref. del artículo: DS057569

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