Isbn: 9787030759924 - 低维形态样品组合材料芯片高通量制备技术与示范应用 (1 resultados)

paperback. Condición: New. Language:Chinese.Paperback. Pub Date: 2023-09 Pages: 480 Publisher: Science Press This book focuses on the high-throughput preparation technology and application demonstration of thin film. thick film and powder sample combination material chips. The content is based on the national key R&D plan project Key technologies and equipment for high-throughput preparation and rapid screening of low-dimensional combination material chips (2016YFB0700200). and at the same time adds research progress. .…