Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS) - Tapa dura

Schwizer, Jürg; Mayer, Michael; Brand, Oliver

 
9783540221876: Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)
Tapa dura
ISBN 10: 3540221875 ISBN 13: 9783540221876
Editorial: Springer, 2004

Sinopsis

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

"Sinopsis" puede pertenecer a otra edición de este libro.

De la contraportada

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Springer
Año de publicación
2004
Idioma
Inglés
ISBN 10 
3540221875
ISBN 13 
9783540221876
Encuadernación
Tapa dura
Número de páginas
188
Contacto del fabricante
no disponible
Persona responsable
CMN Printpool Inh. Mathis Neumann
https://www.also.com/ec/cms5/en_6000/6000/index.jsp

Friedrich-Karl-Str. 9
Hamburg
Alemania

Otras ediciones populares con el mismo título

9783642060632: Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)

Edición Destacada

ISBN 10:  3642060633 ISBN 13:  9783642060632
Editorial: Springer, 2010
Tapa blanda