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Sinopsis
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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De la contraportada
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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Wafer Bonding
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Springer Berlin Heidelberg, 2004
ISBN 10: 3540210490
ISBN 13: 9783540210498
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Librería: moluna, Greven, Alemania
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Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingPresents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingInclu. Nº de ref. del artículo: 4884987
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Wafer Bonding
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Springer Berlin Heidelberg Mai 2004, 2004
ISBN 10: 3540210490
ISBN 13: 9783540210498
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator,photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. 520 pp. Englisch. Nº de ref. del artículo: 9783540210498
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Wafer Bonding
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Condición: New. In English. Nº de ref. del artículo: ria9783540210498_new
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Wafer Bonding
Publicado por
Springer Berlin Heidelberg, Springer Berlin Heidelberg Mai 2004, 2004
ISBN 10: 3540210490
ISBN 13: 9783540210498
Nuevo
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
Calificación del vendedor: 5 de 5 estrellas
Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 520 pp. Englisch. Nº de ref. del artículo: 9783540210498
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Wafer Bonding : Applications and Technology
Librería: AHA-BUCH GmbH, Einbeck, Alemania
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator,photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. Nº de ref. del artículo: 9783540210498
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Wafer Bonding: Applications and Technology
Librería: Revaluation Books, Exeter, Reino Unido
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Hardcover. Condición: Brand New. 1st edition. 499 pages. 9.25x6.25x0.75 inches. In Stock. Nº de ref. del artículo: x-3540210490
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