Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) - Tapa blanda

Salah, Khaled; Ismail, Yehea; El-Rouby, Alaa

 
9783319374970: Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)
Tapa blanda
ISBN 10: 3319374974 ISBN 13: 9783319374970
Editorial: Springer, 2016

Sinopsis

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

"Sinopsis" puede pertenecer a otra edición de este libro.

De la contraportada

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects.  Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis, and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor,  and inductive-based communication system, and bandpass filtering.

·Introduces a robust model that captures accurately all the loss modes of a TSV,  coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region;

·Enables readers to use a model which is technology dependent and can be used for any TSV configuration;

·Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors;

·Equips readers for fast parasitic extraction of TSVs for 3D IC design.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Springer
Año de publicación
2016
Idioma
Inglés
ISBN 10 
3319374974
ISBN 13 
9783319374970
Encuadernación
Tapa blanda
Número de páginas
192
Contacto del fabricante
no disponible
Persona responsable
CMN Printpool Inh. Mathis Neumann
https://www.also.com/ec/cms5/en_6000/6000/index.jsp

Friedrich-Karl-Str. 9
Hamburg
Alemania

Otras ediciones populares con el mismo título

9783319076102: Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)

Edición Destacada

ISBN 10:  3319076108 ISBN 13:  9783319076102
Editorial: Springer, 2014
Tapa dura