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Arbitrary Modeling of TSVs for 3D Integrated Circuits - Tapa blanda
Libro 75 de 124: Analog Circuits and Signal Processing
Sinopsis
Introduction: Work around Moore's Law.- 3D/TSV Enabling Technologies.- TSV Modeling and Analysis.- TSV Verification.- TSV Macro-Modeling Framework.- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter.- Imperfection in TSV Modeling.- New Trends in TSV.- TSV Fabrication.- Conclusions.
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