Artículos relacionados a Arbitrary Modeling of TSVs for 3D Integrated Circuits...

Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) - Tapa dura

Libro 75 de 124: Analog Circuits and Signal Processing

El-Rouby, Alaa; Salah, Khaled; Ismail, Yehea

 
9783319076102: Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)
Tapa dura
ISBN 10: 3319076108 ISBN 13: 9783319076102
Editorial: Springer, 2014

Sinopsis

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

"Sinopsis" puede pertenecer a otra edición de este libro.

De la contraportada

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance, and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis, and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor, and inductive-based communication system, and bandpass filtering.

·Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region;

·Enables readers to use a model which is technology dependent and can be used for any TSV configuration;

·Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors;

·Equips readers for fast parasitic extraction of TSVs for 3D IC design.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Springer
Año de publicación
2014
Idioma
Inglés
ISBN 10 
3319076108
ISBN 13 
9783319076102
Encuadernación
Tapa dura
Número de páginas
192
Contacto del fabricante
Springer Nature Customer Service Center GmbH
ProductSafety@springernature.com

Europaplatz 3
Heidelberg
69115
Alemania