High-Bandwidth Memory Interface (SpringerBriefs in Electrical and Computer Engineering) - Tapa blanda

Libro 45 de 209: SpringerBriefs in Electrical and Computer Engineering

Kim, Chulwoo

 
9783319023809: High-Bandwidth Memory Interface (SpringerBriefs in Electrical and Computer Engineering)
Tapa blanda
ISBN 10: 3319023802 ISBN 13: 9783319023809
Editorial: Springer, 2013

Sinopsis

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

"Sinopsis" puede pertenecer a otra edición de este libro.

De la contraportada

<p>This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered. <br> <br>• Enables readers with minimal background in memory design to understand the basics of high-bandwidth memory interface design; <br>• Presents state-of-the-art techniques for memory interface design;<br>• Covers memory interface design at both the circuit level and system architecture level.<br></p>

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Springer
Año de publicación
2013
Idioma
Inglés
ISBN 10 
3319023802
ISBN 13 
9783319023809
Encuadernación
Tapa blanda
Número de páginas
96
Contacto del fabricante
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