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Sinopsis
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
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Back Cover CopySERIES:Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors)Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; Covers the entire architectural design approach for 3D-SoCs; Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.
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3D Integration for NoC-based SoC Architectures
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-. Nº de ref. del artículo: 4197730
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3D Integration for NoC-based SoC Architectures
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Springer New York Dez 2012, 2012
ISBN 10: 1461427487
ISBN 13: 9781461427483
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch. Nº de ref. del artículo: 9781461427483
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3D Integration for NoC-based SoC Architectures
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Springer US, Springer New York, 2012
ISBN 10: 1461427487
ISBN 13: 9781461427483
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Librería: AHA-BUCH GmbH, Einbeck, Alemania
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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. Nº de ref. del artículo: 9781461427483
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
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3D Integration for NoC-based SoC Architectures
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Springer US, Springer New York Dez 2012, 2012
ISBN 10: 1461427487
ISBN 13: 9781461427483
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 288 pp. Englisch. Nº de ref. del artículo: 9781461427483
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3D Integration for NoC-based SoC Architectures
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Springer-Verlag New York Inc., 2012
ISBN 10: 1461427487
ISBN 13: 9781461427483
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
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3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
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Paperback. Condición: Like New. Like New. book. Nº de ref. del artículo: ERICA79714614274876
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