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Interfacial Compatibility in Microelectronics: Moving Away from the Trial and Error Approach (Microsystems) - Tapa blanda
Sinopsis
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.
In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes:
solutions to several common reliability issues in microsystem technology,
methods to understand and predict failure mechanisms at interfaces between dissimilar materials and
an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.
Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
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De la contraportada
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the traditional method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.
In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes:
solutions to several common reliability issues in microsystem technology,
methods to understand and predict failure mechanisms at interfaces between dissimilar materials and
an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.
Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
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Interfacial Compatibility in Microelectronics
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides solutions to several common reliability issues in microsystem packagingTeaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materialsCombines thermodynamic-diffusion kinetic model. Nº de ref. del artículo: 4185523
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Laurila:Interfacial Compatibility in Mi (eng)
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Interfacial Compatibility in Microelectronics: Moving Away from the Trial and Error Approach (Microsystems)
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Interfacial Compatibility in Microelectronics
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Springer London Feb 2014, 2014
ISBN 10: 1447160681
ISBN 13: 9781447160687
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the 'traditional' method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike. 228 pp. Englisch. Nº de ref. del artículo: 9781447160687
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Interfacial Compatibility in Microelectronics : Moving Away from the Trial and Error Approach
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Springer London, Springer London, 2014
ISBN 10: 1447160681
ISBN 13: 9781447160687
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Taschenbuch
Librería: AHA-BUCH GmbH, Einbeck, Alemania
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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the 'traditional' method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike. Nº de ref. del artículo: 9781447160687
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Interfacial Compatibility in Microelectronics : Moving Away from the Trial and Error Approach
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Interfacial Compatibility in Microelectronics
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Springer London, Springer London Feb 2014, 2014
ISBN 10: 1447160681
ISBN 13: 9781447160687
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Taschenbuch. Condición: Neu. Neuware -Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the ¿traditional¿ method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes:solutions to several common reliability issues in microsystem technologymethods to understand and predict failure mechanisms at interfaces between dissimilar materials andan approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 228 pp. Englisch. Nº de ref. del artículo: 9781447160687
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Interfacial Compatibility in Microelectronics: Moving Away from the Trial and Error Approach (Microsystems)
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Interfacial Compatibility in Microelectronics: Moving Away from the Trial and Error Approach
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Interfacial Compatibility in Microelectronics (Paperback)
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Springer London Ltd, England, 2014
ISBN 10: 1447160681
ISBN 13: 9781447160687
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Paperback. Condición: new. Paperback. Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the traditional method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced.In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA.Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike. This book provides solutions to several common reliability issues in microsystem packaging. It teaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materials. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Nº de ref. del artículo: 9781447160687
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