Development and Packaging of Microsystems Using Foundry Services - Tapa blanda

Butler, Jeffrey T.

 
9781286866931: Development and Packaging of Microsystems Using Foundry Services
Tapa blanda
ISBN 10: 1286866936 ISBN 13: 9781286866931
Editorial: BiblioScholar, 2012

Sinopsis

Micro-electro-mechanical systems (MEMS) is a relatively new and rapidly growing field of research. Several advances to the MEMS and microsystem state of the art were achieved through the design and characterization of novel MEMS devices and packaging, which are compatible with CMOS microelectronics. Empirical and theoretical models of polysilicon thermal actuators were developed to understand and simulate the behavior of thermal actuators. These models can be implemented in microelectronic circuit simulators such as SPICE and allow the simultaneous simulation of thermally actuated MEMS and microelectronics. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10-3 K-1. In addition, the sheet resistance of all the MUMPs polysilicon layers was found to be dependent on the linewidth due to the presence or absence of lateral phosphorus diffusion.

"Sinopsis" puede pertenecer a otra edición de este libro.

Reseña del editor

Micro-electro-mechanical systems (MEMS) is a relatively new and rapidly growing field of research. Several advances to the MEMS and microsystem state of the art were achieved through the design and characterization of novel MEMS devices and packaging, which are compatible with CMOS microelectronics. Empirical and theoretical models of polysilicon thermal actuators were developed to understand and simulate the behavior of thermal actuators. These models can be implemented in microelectronic circuit simulators such as SPICE and allow the simultaneous simulation of thermally actuated MEMS and microelectronics. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10-3 K-1. In addition, the sheet resistance of all the MUMPs polysilicon layers was found to be dependent on the linewidth due to the presence or absence of lateral phosphorus diffusion.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
BiblioScholar
Año de publicación
2012
Idioma
Inglés
ISBN 10 
1286866936
ISBN 13 
9781286866931
Encuadernación
Tapa blanda
Número de páginas
328
Contacto del fabricante
no disponible
Persona responsable
no disponible