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Materials, Technology and Reliability for Advanced Interconnects and LowK Dielectrics: Volume 612 (MRS Proceedings) - Tapa blanda

Oehrlein, G. S.

 
9781107413153: Materials, Technology and Reliability for Advanced Interconnects and LowK Dielectrics: Volume 612 (MRS Proceedings)
Tapa blanda
ISBN 10: 110741315X ISBN 13: 9781107413153
Editorial: Cambridge University Press, 2014

Sinopsis

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

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Reseña del editor

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.

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Editorial
Cambridge University Press
Año de publicación
2014
Idioma
Inglés
ISBN 10 
110741315X
ISBN 13 
9781107413153
Encuadernación
Tapa blanda
Número de páginas
612
Contacto del fabricante
no disponible
Persona responsable
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