Artículos relacionados a MEMS Packaging (Materials, Circuits and Devices)

MEMS Packaging (Materials, Circuits and Devices) - Tapa dura

 
9780863413353: MEMS Packaging (Materials, Circuits and Devices)
Tapa dura
ISBN 10: 0863413358 ISBN 13: 9780863413353
Editorial: Institution of Engineering and Technology, 2003

Sinopsis

Written as a collective work by 14 outstanding microsystems packaging specialists from US industries, government laboratories and universities, MEMS Packaging provides a comprehensive view of the prevalent practices and enabling techniques in the assembly, packaging and testing of MEMS and microsystems. The book also addresses aspects of microassembly and testing technologies that are often overlooked.

Aimed at professional engineers, scientists and technologists from industry, research laboratories and universities, the book examines every aspect of the assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in the key industries of life sciences, telecommunication and aerospace engineering. The authors cover key topics such as bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, RF telecommunications and aerospace applications.

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Acerca del autor

Professor Tai-Ran Hsu received his PhD in mechanical engineering from McGill University, Canada. He worked extensively in the power plant equipment and nuclear industries before moving into academia. He is currently Professor and Director of Microsystems Design and Packaging Laboratory at San Jose State University, and has published over 120 technical papers and five books in FE, CAD and MEMS design, manufacture and packaging.

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Editorial
Institution of Engineering and Technology
Año de publicación
2003
Idioma
Inglés
ISBN 10 
0863413358
ISBN 13 
9780863413353
Encuadernación
Tapa dura
Número de páginas
304
Editor
Hsu Tai-Ran
Contacto del fabricante
no disponible
Persona responsable
no disponible