Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging Series) - Tapa dura

Pecht, Michael; Radojcic, Riko; Rao, Gopal

 
9780849396243: Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging Series)

Sinopsis

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.

This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?

Chapters discuss:

  • failure sites, operational loads, and failure mechanism
  • intrinsic device sensitivities
  • electromigration
  • hot carrier aging
  • time dependent dielectric breakdown
  • mechanical stress induced migration
  • alpha particle sensitivity
  • electrostatic discharge (ESD) and electrical overstress
  • latch-up
  • qualification
  • screening
  • guidelines for designing reliability

    Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
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    Acerca del autor

    Pecht, Michael; Radojcic, Riko; Rao, Gopal

    "Sobre este título" puede pertenecer a otra edición de este libro.

    Otras ediciones populares con el mismo título

    9780367400064: Guidebook for Managing Silicon Chip Reliability: 5 (Electronic Packaging)

    Edición Destacada

    ISBN 10:  0367400065 ISBN 13:  9780367400064
    Editorial: CRC Press, 2019
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