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Microelectronic Interconnections and Assembly: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996: v. 54 (NATO Science Partnership Subseries 3: High Technology) - Tapa dura
Sinopsis
Preface. 1. Packaging and Interconnection Trends - Present and Future. 2. Solder and Flip Chip Interconnections and Assembly. 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB. 4. Multichip Module Interconnections and Assembly I. 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters. 6. Multichip Module Interconnections and Assembly II. 7. Thick Film Interconnections and Metallurgical Interactions I. 8. Thick Film Interconnections and Metallurgical Interactions II. Subject Index.
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Reseña del editor
The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported. Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces.
Reseña del editor
This text covers the proceedings of the NATO Advanced Research Workshop which is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. The basic issue is that the miniaturization of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported. Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces.
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Microelectronic Interconnections and Assembly
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SPRINGER NATURE Aug 1998, 1998
ISBN 10: 0792351398
ISBN 13: 9780792351399
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Calificación del vendedor: 5 de 5 estrellas
Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with. The basic issue is that the miniaturisation of electronic systems continues, and performance must continue to improve. The newest packages are often based on the selection of an appropriate interconnection method. Advances in chip-scale, chip-flip, and direct chip attachments are described. Although wire bonding currently dominates the market, the consensus is that flip chip interconnection will rapidly increase its market share. Tape automated bonding is also discussed, primarily for special applications. Solder metallurgy and flip chip production technology receive attention in several papers. Solderability, reliability and fatigue of the joints are modelled, and mechanical stresses resulting from temperature cycling are reported. Multichip module and thick-film hybrid substrate interconnections are reported in several papers. These include thick and thin film metals, as well as low temperature polymer inks. Several papers describe diffusion and other metallurgical interactions in thick film surfaces. 316 pp. Englisch. Nº de ref. del artículo: 9780792351399
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Microelectronic Interconnections and Assembly (NATO Science Partnership Sub-Series: 3:)
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Microelectronic Interconnections and Assembly: Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996
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Kluwer Academic Publishers, 1998
ISBN 10: 0792351398
ISBN 13: 9780792351399
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Librería: THE SAINT BOOKSTORE, Southport, Reino Unido
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Microelectronic Interconnections and Assembly
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Springer Netherlands|Springer, Berlin, 1998
ISBN 10: 0792351398
ISBN 13: 9780792351399
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Librería: moluna, Greven, Alemania
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Gebunden. Condición: New. The Workshop is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also. Nº de ref. del artículo: 898698186
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Microelectronic Interconnections and Assembly
Librería: Revaluation Books, Exeter, Reino Unido
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Hardcover. Condición: Brand New. 299 pages. 9.75x6.50x1.00 inches. In Stock. Nº de ref. del artículo: x-0792351398
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