Explains the latest design methods, modeling tools, simulation techniques, and manufacturing procedures of microelectronics packaging
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Explains the latest design methods, modeling tools, simulation techniques, and manufacturing procedures of microelectronics packaging
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Librería: HPB-Diamond, Dallas, TX, Estados Unidos de America
Hardcover. Condición: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority! Nº de ref. del artículo: S_467516960
Cantidad disponible: 1 disponibles
Librería: HPB-Red, Dallas, TX, Estados Unidos de America
hardcover. Condición: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Nº de ref. del artículo: S_406158836
Cantidad disponible: 1 disponibles
Librería: Better World Books, Mishawaka, IN, Estados Unidos de America
Condición: Good. 1st Edition. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Nº de ref. del artículo: 9707452-75
Cantidad disponible: 1 disponibles
Librería: ThriftBooks-Atlanta, AUSTELL, GA, Estados Unidos de America
Hardcover. Condición: Good. No Jacket. Former library book; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. Nº de ref. del artículo: G0442205783I3N10
Cantidad disponible: 1 disponibles
Librería: Better World Books, Mishawaka, IN, Estados Unidos de America
Condición: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Nº de ref. del artículo: 8122973-6
Cantidad disponible: 1 disponibles
Librería: Better World Books Ltd, Dunfermline, Reino Unido
Condición: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Nº de ref. del artículo: 8122973-6
Cantidad disponible: 1 disponibles
Librería: A Squared Books (Don Dewhirst), South Lyon, MI, Estados Unidos de America
Hardcover. Condición: Very Good. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additional shipping charges may need to be requested due to size or weight of book. Nº de ref. del artículo: SKU1149536
Cantidad disponible: 1 disponibles
Librería: WeBuyBooks, Rossendale, LANCS, Reino Unido
Condición: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. A few small marks or stains to the page edges/pages . Previous owners name inside the front page/cover. Nº de ref. del artículo: rev2723883316
Cantidad disponible: 1 disponibles
Librería: Longs Peak Book Company, Loveland, CO, Estados Unidos de America
Hardcover. Condición: Near Fine. 1st Edition. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. This copy is in excellent condition, a second printing of the first edition, a hardback with no dustjacket . Given the book's size and weight--3# 13oz-- shipping charges will be adjusted.The book will be carefully wrapped and boxed for safe shipping. Nº de ref. del artículo: 003422
Cantidad disponible: 1 disponibles
Librería: BookDepart, Shepherdstown, WV, Estados Unidos de America
Hardcover. Condición: UsedVeryGood. Hardback with dust jacket. Light shelf wear to exterior; discard stamp on exterior bottom page edge; former owner's name blacked out at top of exterior page edge; former owner's name written on front end page; otherwise in very good condition with clean text, firm binding. Dust jacket, light fading, light shelf wear. Nº de ref. del artículo: 73848
Cantidad disponible: 1 disponibles