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Sinopsis
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
"Sinopsis" puede pertenecer a otra edición de este libro.
Críticas
`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997
Reseña del editor
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.
Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
"Sobre este título" puede pertenecer a otra edición de este libro.
- EditorialSpringer
- Año de publicación1997
- ISBN 10 0412084511
- ISBN 13 9780412084515
- EncuadernaciónTapa dura
- IdiomaInglés
- Número de edición2
- Número de páginas664
- Contacto del fabricanteno disponible
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Publicado por
Kluwer Academic, 1997
ISBN 10: 0412084511
ISBN 13: 9780412084515
Antiguo o usado
Tapa dura
Librería: Anybook.com, Lincoln, Reino Unido
Calificación del vendedor: 5 de 5 estrellas
Condición: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:9780412084515. Nº de ref. del artículo: 9755917
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Microelectronics Packaging Handbook: Subsystem Packaging (Volume 3)
Librería: Anybook.com, Lincoln, Reino Unido
Calificación del vendedor: 5 de 5 estrellas
Condición: Good. Volume 3. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780412084515. Nº de ref. del artículo: 5582662
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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hardcover. Condición: New. In shrink wrap. Looks like an interesting title! Nº de ref. del artículo: Q-0412084511
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Librería: HPB-Red, Dallas, TX, Estados Unidos de America
Calificación del vendedor: 5 de 5 estrellas
hardcover. Condición: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Nº de ref. del artículo: S_362962899
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Librería: moluna, Greven, Alemania
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Gebunden. Condición: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books. Nº de ref. del artículo: 458434009
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
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Microelectronics Packaging Handbook
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Microelectronics Packaging Handbook : Subsystem Packaging Part III
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Calificación del vendedor: 5 de 5 estrellas
Buch. Condición: Neu. Neuware - This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging. Nº de ref. del artículo: 9780412084515
Cantidad disponible: 2 disponibles