Embedded System Design: Topics, Techniques and Trends: 231 (IFIP Advances in Information and Communication Technology) - Tapa dura

Reseña del editor

This volume presents the technical program of the 2007 International Embedded Systems Symposium held in Irvine, California. It covers timely topics, techniques and trends in embedded system design, including design methodology, networks-on-chip, distributed and networked systems, and system verification. It places emphasis on automotive and medical applications and includes case studies and special aspects in embedded system design.

Contraportada

Over recent years, embedded systems have gained an enormous amount of processing power and functionality. Many of the formerly external components can now be integrated into a single System-on-Chip. This tendency has resulted in a dramatic reduction in the size and cost of embedded systems. As a unique technology, the design of embedded systems is an essential element of many innovations.

Embedded System Design: Topics, Techniques and Trends presents the technical program of the International Embedded Systems Symposium (IESS) 2007 held in Irvine, California. IESS is a unique forum to present novel ideas, exchange timely research results, and discuss the state of the art and future trends in the field of embedded systems. Contributors and participants from both industry and academia take active part in this symposium. The IESS conference is organized by the Computer Systems Technology committee (TC10) of the International Federation for Information Processing (IFIP).

Timley topics, techniques and trends in embedded system design are covered by the chapters in this book, including design methodology, specification and modeling, embedded software and hardware synthesis, networks-on-chip, distributed and networked systems, and system verification and validation. Particular emphaisis is paid to automotive and medical applications. A set of actual case studies and special aspects in embedded system design are included as well.