Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging - Tapa blanda

Wei, Xing-Chang

 
9780367573669: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Tapa blanda
ISBN 10: 0367573660 ISBN 13: 9780367573669
Editorial: CRC Press, 2020

Sinopsis

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.

This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

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Acerca del autor

Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi’an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institute of Engineers Prestigious Engineering Achievement Award for his contribution to the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China’s Ministry of Education.

His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.

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Editorial
CRC Press
Año de publicación
2020
Idioma
Inglés
ISBN 10 
0367573660
ISBN 13 
9780367573669
Encuadernación
Tapa blanda
Número de edición
1
Número de páginas
322
Contacto del fabricante
Taylor and Francis, GPSR Taylor and Francis
gpsr@taylorandfrancis.com

Taylor & Francis Verlag GmbH, Kaufingerstraße 24
München
80331
Alemania

Otras ediciones populares con el mismo título

9781138033566: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Edición Destacada

ISBN 10:  1138033561 ISBN 13:  9781138033566
Editorial: CRC Press, 2017
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