System on Package: Miniaturization of the Entire System (ELECTRONICS) - Tapa dura

Tummala, Rao

 
9780071459068: System on Package: Miniaturization of the Entire System (ELECTRONICS)
Tapa dura
ISBN 10: 0071459065 ISBN 13: 9780071459068
Editorial: McGraw Hill, 2008

Sinopsis

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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

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Acerca del autor

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

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Editorial
McGraw Hill
Año de publicación
2008
Idioma
Inglés
ISBN 10 
0071459065
ISBN 13 
9780071459068
Encuadernación
Tapa dura
Número de edición
1
Número de páginas
785
Contacto del fabricante
no disponible
Persona responsable
no disponible