Tsv tsv integration hr si (1 resultados)
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Librería: liu xing, Nanjing, JS, Chinaliu xing
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 285,49
Envío por EUR 15,83Se envía de China a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: New. HardCover.Pub Date:2021-12-01 Pages:273 Language:English Publisher:Chemical Industry Press 3D RF integration application is an important application development direction of through silicon via (TSV) 3D integration technology. With the rise of 5G and millimeter-wave applications. thin-film bulk acoustic resonator (FBAR) devices based on high-resistance silicon TSV wafer-level packaging. and radio frequency microelectromechanical system (RF MEMS) switching devices have gradually achieved comme.…
