Test procedures developing solder de siewert (5 resultados)

PAP. Condición: New. New Book. Shipped from UK. Established seller since 2000.

PAP. Condición: New. New Book. Shipped from UK. Established seller since 2000.

HRD. Condición: New. New Book. Shipped from UK. Established seller since 2000.

HRD. Condición: New. New Book. Shipped from UK. Established seller since 2000.

Paperback. Condición: New. Print on Demand. This book gathers standardized test procedures for lead-free solders from various researchers with the aim to facilitate the comparison of data, and the combination of data from different sources into a single, comprehensive database. In this book, the author emphasizes the need for standardization in lead-free solder testing, given the different procedures that laboratories continue to develop, sometimes having to replicate the experiments of others due to differences in procedures. The book addresses this issue by providing standardized methods for evaluating the mechanical properties of lead-free solders, such as melting and solidication temperatures, wetting behaviour, tensile strength, creep, and fatigue resistance. It also includes procedures for measuring the growth rate of intermetallic compounds, fracture toughness, and acoustic measurements of elastic constants. The book concludes by discussing the significance of these standardized procedures in facilitating the adoption of lead-free solders in high-volume, automated production of electronic assemblies, especially when combined with high quality and low-cost expectations. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item.…