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Añadir al carritoCondición: New. pp. 316.
Librería: Books Puddle, New York, NY, Estados Unidos de America
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Librería: Majestic Books, Hounslow, Reino Unido
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Añadir al carritoCondición: New. pp. 316 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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Añadir al carritoTaschenbuch. Condición: Neu. Structural Analysis of Printed Circuit Board Systems | Peter A. Engel | Taschenbuch | XIX | Englisch | 2012 | Springer | EAN 9781461269458 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 204,08
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Añadir al carritoCondición: New. pp. 316.
Publicado por Springer New York, Springer US Jun 1993, 1993
ISBN 10: 0387979395 ISBN 13: 9780387979397
Idioma: Inglés
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 160,49
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Añadir al carritoBuch. Condición: Neu. Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 316 pp. Englisch.
Publicado por Springer New York, Springer New York, 2012
ISBN 10: 1461269458 ISBN 13: 9781461269458
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 168,73
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Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.
Publicado por Springer New York, Springer US, 1993
ISBN 10: 0387979395 ISBN 13: 9780387979397
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 168,73
Cantidad disponible: 1 disponibles
Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 225,09
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Añadir al carritoPaperback. Condición: Like New. Like New. book.
Publicado por New York, Springer (1993)., 1993
Librería: Antiquariat Löcker, Wien, Austria
EUR 78,00
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Añadir al carritoXIX, 291 S. With 192 Figures. OPappband, Name a.V., sonst wie neu. (= Mechanical Engineering Series).
Publicado por Springer-Verlag 1993, 1993
Librería: Wonderland Books, Berkeley, CA, Estados Unidos de America
EUR 79,46
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Añadir al carritoed. hardback very good condition - no dust jacket.
Publicado por Springer New York Sep 2012, 2012
ISBN 10: 1461269458 ISBN 13: 9781461269458
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 139,09
Cantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. 316 pp. Englisch.
Publicado por Springer New York Jun 1993, 1993
ISBN 10: 0387979395 ISBN 13: 9780387979397
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 160,49
Cantidad disponible: 2 disponibles
Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. 316 pp. Englisch.
Librería: moluna, Greven, Alemania
EUR 136,16
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansi.
Librería: preigu, Osnabrück, Alemania
EUR 141,90
Cantidad disponible: 5 disponibles
Añadir al carritoBuch. Condición: Neu. Structural Analysis of Printed Circuit Board Systems | Peter A. Engel | Buch | xix | Englisch | 1993 | Springer US | EAN 9780387979397 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Publicado por Springer New York, Springer New York Sep 2012, 2012
ISBN 10: 1461269458 ISBN 13: 9781461269458
Idioma: Inglés
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 160,49
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 316 pp. Englisch.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 221,26
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Añadir al carritoCondición: New. Print on Demand pp. 316 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 223,16
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Añadir al carritoCondición: New. PRINT ON DEMAND pp. 316.