silicon devices process integration de el kareh badih (19 resultados)

Condición: Sehr gut. Zustand: Sehr gut | Seiten: 598 | Sprache: Englisch | Produktart: Bücher.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author's industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include:A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;CMOS-only applications, such as subthreshold current and parasitic latch-up;Advanced Enabling processes and process integration.This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

Condición: New. In.

Condición: New. In.

Condición: New. pp. 624.

Condición: New.

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author's industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include:A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;CMOS-only applications, such as subthreshold current and parasitic latch-up;Advanced Enabling processes and process integration.This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

Paperback. Condición: Like New. Like New. book.

Condición: New.

Hardcover. Condición: Like New. Like New. book.

hardcover. Condición: Good. Hardback. No dust jacket. Cover edges and corners in good shape. Spine is tight. Pages are clean, no markings, notes or stains. Ships from Friends bookstore to benefit Beaverton (Oregon) library.

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Focuses on process integration techniques and technologyAddresses both raw silicon material and demonstrates their use in componentsSilicon Devices and Process Integration covers state-of-the-art silicon device.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author's industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include:A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;CMOS-only applications, such as subthreshold current and parasitic latch-up;Advanced Enabling processes and process integration.This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. 624 pp. Englisch.

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author¿s industrial and academic lecture notes and reflects years of experience in the development of silicon devices.Features include:A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;CMOS-only applications, such as subthreshold current and parasitic latch-up;Advanced Enabling processes and process integration.This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 624 pp. Englisch.

Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Focuses on process integration techniques and technologyAddresses both raw silicon material and demonstrates their use in componentsSilicon Devices and Process Integration covers state-of-the-art silicon device.

Paperback / softback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 892.

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author's industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include:A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;CMOS-only applications, such as subthreshold current and parasitic latch-up;Advanced Enabling processes and process integration.This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. 598 pp. Englisch.

Condición: New. Print on Demand pp. 624 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Condición: New. PRINT ON DEMAND pp. 624.