parametric reliability space based field de pomager joseph (31 resultados)

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Condición: Like New. This is a reproduction of an out of print title. This book may have occasional imperfections such as missing or blurred pages, poor pictures, errant marks, etc. that were either part of the original artifact, or were introduced by the scanning process. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.

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Buch. Condición: Neu. Neuware - The high cost of failure for microelectronic devices operating in the space environment has led to a need for an accurate characterization of a device's reliability prior to being deployed. In addition, significant cost savings can be achieved by determining this reliability prior to fabrication. High performance and flexibility requirements for many space applications have led to an integration of small feature-sized field programmable gate arrays (FPGA) into system designs. Specifically, feature sizes as small as 130, 90, and 65 nm. In this research, a characterization of the space environment is constructed specifically to address the typical conditions that can affect the performance and functionality of small feature-sized FPGAs, centered on temperature, non-ideal supply voltage, and radiation effects. A simulation technique is developed to determine the reliability of a microelectronic device prior to fabrication and deployment into the space environment. The technique is based on identifying the key elements of a circuit, simulating these key elements under each characterized condition individually, and then a comprehensive simulation of the elements under all enumerated combinations of the characterized conditions at the transistor-level using the HSPICE device simulation tool. Reliability calculations are performed based on simulation results and identified critical performance criteria. A demonstration of the technique is accomplished showing the poor reliability of non-radiation hardened small feature-sized commercial-off-the-shelf (COTS) FPGAs in four common satellite orbits around the earth. The results are then compared to an established, radiation hardened FPGA.

Condición: New. The high cost of failure for microelectronic devices operating in the space environment has led to a need for an accurate characterization of a device&aposs reliability prior to being deployed. In addition, significant cost savings can be achieved by deter.

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Taschenbuch. Condición: Neu. Neuware - The high cost of failure for microelectronic devices operating in the space environment has led to a need for an accurate characterization of a device's reliability prior to being deployed. In addition, significant cost savings can be achieved by determining this reliability prior to fabrication. High performance and flexibility requirements for many space applications have led to an integration of small feature-sized field programmable gate arrays (FPGA) into system designs. Specifically, feature sizes as small as 130, 90, and 65 nm. In this research, a characterization of the space environment is constructed specifically to address the typical conditions that can affect the performance and functionality of small feature-sized FPGAs, centered on temperature, non-ideal supply voltage, and radiation effects. A simulation technique is developed to determine the reliability of a microelectronic device prior to fabrication and deployment into the space environment. The technique is based on identifying the key elements of a circuit, simulating these key elements under each characterized condition individually, and then a comprehensive simulation of the elements under all enumerated combinations of the characterized conditions at the transistor-level using the HSPICE device simulation tool. Reliability calculations are performed based on simulation results and identified critical performance criteria. A demonstration of the technique is accomplished showing the poor reliability of non-radiation hardened small feature-sized commercial-off-the-shelf (COTS) FPGAs in four common satellite orbits around the earth. The results are then compared to an established, radiation hardened FPGA.

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Paperback. Condición: new. Paperback. The high cost of failure for microelectronic devices operating in the space environment has led to a need for an accurate characterization of a device's reliability prior to being deployed. In addition, significant cost savings can be achieved by determining this reliability prior to fabrication. High performance and flexibility requirements for many space applications have led to an integration of small feature-sized field programmable gate arrays (FPGA) into system designs. Specifically, feature sizes as small as 130, 90, and 65 nm. In this research, a characterization of the space environment is constructed specifically to address the typical conditions that can affect the performance and functionality of small feature-sized FPGAs, centered on temperature, non-ideal supply voltage, and radiation effects. A simulation technique is developed to determine the reliability of a microelectronic device prior to fabrication and deployment into the space environment. The technique is based on identifying the key elements of a circuit, simulating these key elements under each characterized condition individually, and then a comprehensive simulation of the elements under all enumerated combinations of the characterized conditions at the transistor-level using the HSPICE device simulation tool. Reliability calculations are performed based on simulation results and identified critical performance criteria. A demonstration of the technique is accomplished showing the poor reliability of non-radiation hardened small feature-sized commercial-off-the-shelf (COTS) FPGAs in four common satellite orbits around the earth. The results are then compared to an established, radiation hardened FPGA.This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work was reproduced from the original artifact, and remains as true to the original work as possible. Therefore, you will see the original copyright references, library stamps (as most of these works have been housed in our most important libraries around the world), and other notations in the work.This work is in the public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work.As a reproduction of a historical artifact, this work may contain missing or blurred pages, poor pictures, errant marks, etc. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

Condición: New. Print on Demand pp. 88.

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Hardcover. Condición: new. Hardcover. The high cost of failure for microelectronic devices operating in the space environment has led to a need for an accurate characterization of a device's reliability prior to being deployed. In addition, significant cost savings can be achieved by determining this reliability prior to fabrication. High performance and flexibility requirements for many space applications have led to an integration of small feature-sized field programmable gate arrays (FPGA) into system designs. Specifically, feature sizes as small as 130, 90, and 65 nm. In this research, a characterization of the space environment is constructed specifically to address the typical conditions that can affect the performance and functionality of small feature-sized FPGAs, centered on temperature, non-ideal supply voltage, and radiation effects. A simulation technique is developed to determine the reliability of a microelectronic device prior to fabrication and deployment into the space environment. The technique is based on identifying the key elements of a circuit, simulating these key elements under each characterized condition individually, and then a comprehensive simulation of the elements under all enumerated combinations of the characterized conditions at the transistor-level using the HSPICE device simulation tool. Reliability calculations are performed based on simulation results and identified critical performance criteria. A demonstration of the technique is accomplished showing the poor reliability of non-radiation hardened small feature-sized commercial-off-the-shelf (COTS) FPGAs in four common satellite orbits around the earth. The results are then compared to an established, radiation hardened FPGA.This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work was reproduced from the original artifact, and remains as true to the original work as possible. Therefore, you will see the original copyright references, library stamps (as most of these works have been housed in our most important libraries around the world), and other notations in the work.This work is in the public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work.As a reproduction of a historical artifact, this work may contain missing or blurred pages, poor pictures, errant marks, etc. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.