Microstructure properties high performance copper de wang chang (1 resultados)

- Tapa blanda
Librería: liu xing, Nanjing, JS, Chinaliu xing
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 61,56
Envío por EUR 15,57Se envía de China a Estados Unidos de AmericaCantidad disponible: 5 disponibles
paperback. Condición: New. Language:Chinese.Paperback. Pub Date: 2015-12-01 Publisher: Tsinghua University Press book selected industrialized micron SiC powder materials. chemical copper plating process for preparing a Cu-coated SiCp composite powders. and composite powders and composition morphology was analyzed. In the composi…te powder as raw material. the use of vacuum sintering and non-vacuum sintering two processes to prepare SiCp volume fraction of 30%. 40% and 50% of SiCpCu composites and microstructure and Comp.