Librería: Anybook.com, Lincoln, Reino Unido
EUR 9,96
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,650grams, ISBN:0849389577.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 43,12
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. 1st edition NO-PA16APR2015-KAP.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 34,11
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In English.
Librería: Feldman's Books, Menlo Park, CA, Estados Unidos de America
Original o primera edición
EUR 57,59
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Fine. 1st Edition. No Markings.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 65,87
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: California Books, Miami, FL, Estados Unidos de America
EUR 68,22
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 71,45
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Rarewaves USA, OSWEGO, IL, Estados Unidos de America
EUR 79,31
Cantidad disponible: Más de 20 disponibles
Añadir al carritoHardback. Condición: New.
Librería: SHIMEDIA, Brooklyn, NY, Estados Unidos de America
EUR 88,59
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: New. Satisfaction Guaranteed or your money back.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 73,88
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 71,05
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Idioma: Inglés
Publicado por Morgan and Claypool Publishers, 2005
ISBN 10: 1598290045 ISBN 13: 9781598290042
Librería: The Book Spot, Sioux Falls, MN, Estados Unidos de America
EUR 93,03
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: New.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 79,01
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Big River Books, Powder Springs, GA, Estados Unidos de America
EUR 98,05
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: very_good. This book is in Very Good condition. The cover and pages have minor shelf wear. Binding is tight and pages are intact.
Librería: Rarewaves.com USA, London, LONDO, Reino Unido
EUR 102,79
Cantidad disponible: Más de 20 disponibles
Añadir al carritoHardback. Condición: New.
Librería: Rarewaves USA United, OSWEGO, IL, Estados Unidos de America
EUR 81,74
Cantidad disponible: Más de 20 disponibles
Añadir al carritoHardback. Condición: New.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 114,44
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 116,94
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Brand New. 614 pages. 9.25x6.00x1.39 inches. In Stock.
Librería: Buchpark, Trebbin, Alemania
EUR 29,90
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Sehr gut. Zustand: Sehr gut | Seiten: 288 | Sprache: Englisch | Produktart: Bücher | This book aims to cover different aspects of Bias Temperature Instability (BTI). BTI remains as an important reliability concern for CMOS transistors and circuits. Development of BTI resilient technology relies on utilizing artefact-free stress and measurement methods and suitable physics-based models for accurate determination of degradation at end-of-life and understanding the gate insulator process impact on BTI. This book discusses different ultra-fast characterization techniques for recovery artefact free BTI measurements. It also covers different direct measurements techniques to access pre-existing and newly generated gate insulator traps responsible for BTI. The book provides a consistent physical framework for NBTI and PBTI respectively for p- and n- channel MOSFETs, consisting of trap generation and trapping. A physics-based compact model is presented to estimate measured BTI degradation in planar Si MOSFETs having differently processed SiON and HKMG gate insulators, in planar SiGe MOSFETs and also in Si FinFETs. The contents also include a detailed investigation of the gate insulator process dependence of BTI in differently processed SiON and HKMG MOSFETs. The book then goes on to discuss Reaction-Diffusion (RD) model to estimate generation of new traps for DC and AC NBTI stress and Transient Trap Occupancy Model (TTOM) to estimate charge occupancy of generated traps and their contribution to BTI degradation. Finally, a comprehensive NBTI modeling framework including TTOM enabled RD model and hole trapping to predict time evolution of BTI degradation and recovery during and after DC stress for different stress and recovery biases and temperature, during consecutive arbitrary stress and recovery cycles and during AC stress at different frequency and duty cycle. The contents of this book should prove useful to academia and professionals alike.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 147,73
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. pp. 286.
Librería: Basi6 International, Irving, TX, Estados Unidos de America
EUR 167,69
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Librería: preigu, Osnabrück, Alemania
EUR 95,15
Cantidad disponible: 5 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Fundamentals of Bias Temperature Instability in MOS Transistors | Characterization Methods, Process and Materials Impact, DC and AC Modeling | Souvik Mahapatra | Taschenbuch | xvi | Englisch | 2016 | Springer | EAN 9788132234241 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Librería: Rarewaves.com UK, London, Reino Unido
EUR 96,77
Cantidad disponible: Más de 20 disponibles
Añadir al carritoHardback. Condición: New.
Librería: Stephen White Books, Bradford, Reino Unido
EUR 139,62
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Good. Ex-library book, usual markings. Clean copy in good condition. Quick dispatch from UK seller.
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 114,36
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book aims to cover different aspects of Bias Temperature Instability (BTI). BTI remains as an important reliability concern for CMOS transistors and circuits. Development of BTI resilient technology relies on utilizing artefact-free stress and measurement methods and suitable physics-based models for accurate determination of degradation at end-of-life and understanding the gate insulator process impact on BTI. This book discusses different ultra-fast characterization techniques for recovery artefact free BTI measurements. It also covers different direct measurements techniques to access pre-existing and newly generated gate insulator traps responsible for BTI. The book provides a consistent physical framework for NBTI and PBTI respectively for p- and n- channel MOSFETs, consisting of trap generation and trapping. A physics-based compact model is presented to estimate measured BTI degradation in planar Si MOSFETs having differently processed SiON and HKMG gate insulators, in planar SiGe MOSFETs and also in Si FinFETs. The contents also include a detailed investigation of the gate insulator process dependence of BTI in differently processed SiON and HKMG MOSFETs. The book then goes on to discuss Reaction-Diffusion (RD) model to estimate generation of new traps for DC and AC NBTI stress and Transient Trap Occupancy Model (TTOM) to estimate charge occupancy of generated traps and their contribution to BTI degradation. Finally, a comprehensive NBTI modeling framework including TTOM enabled RD model and hole trapping to predict time evolution of BTI degradation and recovery during and after DC stress for different stress and recovery biases and temperature, during consecutive arbitrary stress and recovery cycles and during AC stress at different frequency and duty cycle. The contents of this book should prove useful to academia and professionals alike.
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 114,36
Cantidad disponible: 1 disponibles
Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book aims to cover different aspects of Bias Temperature Instability (BTI). BTI remains as an important reliability concern for CMOS transistors and circuits. Development of BTI resilient technology relies on utilizing artefact-free stress and measurement methods and suitable physics-based models for accurate determination of degradation at end-of-life and understanding the gate insulator process impact on BTI. This book discusses different ultra-fast characterization techniques for recovery artefact free BTI measurements. It also covers different direct measurements techniques to access pre-existing and newly generated gate insulator traps responsible for BTI. The book provides a consistent physical framework for NBTI and PBTI respectively for p- and n- channel MOSFETs, consisting of trap generation and trapping. A physics-based compact model is presented to estimate measured BTI degradation in planar Si MOSFETs having differently processed SiON and HKMG gate insulators, in planar SiGe MOSFETs and also in Si FinFETs. The contents also include a detailed investigation of the gate insulator process dependence of BTI in differently processed SiON and HKMG MOSFETs. The book then goes on to discuss Reaction-Diffusion (RD) model to estimate generation of new traps for DC and AC NBTI stress and Transient Trap Occupancy Model (TTOM) to estimate charge occupancy of generated traps and their contribution to BTI degradation. Finally, a comprehensive NBTI modeling framework including TTOM enabled RD model and hole trapping to predict time evolution of BTI degradation and recovery during and after DC stress for different stress and recovery biases and temperature, during consecutive arbitrary stress and recovery cycles and during AC stress at different frequency and duty cycle. The contents of this book should prove useful to academia and professionals alike.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 161,88
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Like New. Like New. book.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 193,53
Cantidad disponible: 2 disponibles
Añadir al carritoHardcover. Condición: Brand New. 211 pages. 9.61x6.93x0.75 inches. In Stock.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 202,85
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. pp. 269.
Librería: Buchpark, Trebbin, Alemania
EUR 98,31
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Hervorragend. Zustand: Hervorragend | Seiten: 736 | Sprache: Englisch | Produktart: Bücher | The collection focuses on the advancements of characterization of minerals, metals, and materials and the applications of characterization results on the processing of these materials. Advanced characterization methods, techniques, and new instruments are emphasized. Areas of interest include, but are not limited to:· Extraction and processing of various types of minerals, process-structure-property relationship of metal alloys, glasses, ceramics, polymers, composites, semiconductors, and carbon using functional and structural materials.· Novel methods and techniques for characterizing materials across a spectrum of systems and processes. · Characterization of mechanical, thermal, electrical, optical, dielectric, magnetic, physical, and other properties of materials. · Characterization of structural, morphological,and topographical natures of materials at micro- and nano- scales. · Characterization of extraction and processing including process development and analysis. · Advances in instrument developments for microstructure analysis and performance evaluation of materials, such as computer tomography (CT), X-ray and neutron diffraction, electron microscopy (SEM, FIB, TEM), and spectroscopy (EDS, WDS, EBSD) techniques. · 2D and 3D modelling for materials characterization.