Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
EUR 131,00
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Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 133,32
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Añadir al carritoCondición: New. In.
Librería: California Books, Miami, FL, Estados Unidos de America
EUR 148,35
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Añadir al carritoCondición: New.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 147,26
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Añadir al carritoPaperback. Condición: Brand New. reprint edition. 188 pages. 9.25x6.10x0.43 inches. In Stock.
Publicado por Springer International Publishing, Springer International Publishing Dez 2018, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Idioma: Inglés
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 96,29
Cantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author¿s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Publicado por Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 96,29
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
Librería: Mispah books, Redhill, SURRE, Reino Unido
EUR 158,87
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Añadir al carritoPaperback. Condición: New. New. Ships from Multiple Locations. book.
Librería: Revaluation Books, Exeter, Reino Unido
EUR 193,23
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Añadir al carritoHardcover. Condición: Brand New. 187 pages. 9.25x6.10x0.71 inches. In Stock.
Publicado por Springer International Publishing, Springer International Publishing Mär 2018, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Idioma: Inglés
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 139,09
Cantidad disponible: 2 disponibles
Añadir al carritoBuch. Condición: Neu. Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author¿s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Publicado por Springer International Publishing, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 139,09
Cantidad disponible: 1 disponibles
Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 229,27
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New.
Publicado por Springer International Publishing Dez 2018, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 96,29
Cantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. 188 pp. Englisch.
Publicado por Springer International Publishing, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Idioma: Inglés
Librería: moluna, Greven, Alemania
EUR 81,44
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) productsProvides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms.
Publicado por Springer International Publishing Mrz 2018, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 139,09
Cantidad disponible: 2 disponibles
Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. 188 pp. Englisch.
Publicado por Springer International Publishing, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Idioma: Inglés
Librería: moluna, Greven, Alemania
EUR 115,65
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) productsProvides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms.
Publicado por Springer International Publishing, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Idioma: Inglés
Librería: preigu, Osnabrück, Alemania
EUR 120,05
Cantidad disponible: 5 disponibles
Añadir al carritoBuch. Condición: Neu. Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach | Farhang Yazdani | Buch | x | Englisch | 2018 | Springer International Publishing | EAN 9783319757674 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 244,40
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. Print on Demand.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 247,25
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Añadir al carritoCondición: New. PRINT ON DEMAND.