Applying composite model yield problem de warner (2 resultados)

Editorial: IREE Journal of Solid-State Circuits, 1974
- Tapa blanda
Librería: Crossroad Books, Eau Claire, WI, Estados Unidos de AmericaCrossroad Books
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Bueno
EUR 20,18
Envío por EUR 4,79Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Añadir al carritoSelf-wraps. Condición: Very Good. No Dust Jacket. This is a 10-page excerpt; an early reprint of pages 86-95 of the IREE Journal of Solid-State Circuits, Volume sc-9, Number 3. Clean. The pages are just a bit age-toned, but clean. ; 27C; 11" x 8-1/2"; 10 pages.
Más imágenesEditorial: IREE Journal of Solid-State Circuits, 1974
- Tapa blanda
Librería: Crossroad Books, Eau Claire, WI, Estados Unidos de AmericaCrossroad Books
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Bueno
EUR 43,04
Envío por EUR 4,79Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Añadir al carritoSelf-wraps. Condición: Very Good. No Dust Jacket. This is a 10-page excerpt; an early reprint of pages 86-95 of the IREE Journal of Solid-State Circuits, Volume sc-9, Number 3. Clean. The pages are just a bit age-toned, but clean. Includes letters from the IEEE Journal of Solid-State Circuits, to the monograph author, one acknowledging the receipt of the manuscript for this monograph, and the 2nd indicating the acceptance of the monograph for publication (after suggested edits). Both letters have a paper-clip rust stain at the top edge, and one is stapled to the original envelope. Also includes ~30 letters from semiconductor industry figures to the author. Most from within the U. S., but also a couple from around the world. All on company letterheads. These letters requesting an advanced copy of the monograph, as announced in the Nov. 22, 1973 copy of Electronics Magazine. ; 27C; 11" x 8-1/2"; 10 pages.…