9787122379528 - 摩尔时代电子封装建模分析设计与测试 modeling,analysis,design and tests for electronics packaging beyond moore 电子封装书 (1 resultados)
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Librería: liu xing, Nanjing, JS, Chinaliu xing
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 361,70
Envío por EUR 15,54Se envía de China a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: New. HardCover.Pub Date:2021-03-01 Pages:420 Language:English Publisher:Chemical Industry Press This book systematically introduces the theoretical model. analysis and new simulation results of advanced packaging in the ultra-molecular era. The content involves the electrical properties. thermal properties.… thermomechanical properties. heat dissipation issues. reliability issues. electrical crosstalk of 2.5D. 3D. wafer-level packaging. etc. A modeling method based on the volume average theory of p.
