ISBN: 9787121128875 - 半导体光电器件封装工艺(含dvd光盘1张)[wx]战瑛 等电子工业出版社9787121128875 (1 resultados)

paperback. Condición: New. Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor opto. …