9787111753643 - 基于tsv的三维堆叠集成电路的可测性设计与测试优化技术 [美］布兰登·戴 (1 resultados)
- Tapa blanda
Librería: liu xing, Nanjing, JS, Chinaliu xing
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 142,79
Envío por EUR 15,57Se envía de China a Estados Unidos de AmericaCantidad disponible: 3 disponibles
paperback. Condición: New. Language:Chinese.Paperback. Pub Date: 2024-06 Publisher: China Machine Press Testing is a method used to ensure the stability and effectiveness of integrated circuits. and is an indispensable and important means throughout all aspects of integrated circuit manufacturing. The particularity of the TSV-ba…sed 3D stacked integrated circuit structure and the variability of the design process bring new problems and challenges to the testing process. This book first discusses the basic concepts. basi.
