Isbn: 9786138836193 - computational heat transfer analysis of electronic equipments: using finite element analysis approach (8 resultados)

Condición: New.

Taschenbuch. Condición: Neu. Computational Heat Transfer Analysis of Electronic Equipments | Using Finite Element Analysis Approach | Sahil Sharma (u. a.) | Taschenbuch | 60 S. | Englisch | 2019 | Scholars' Press | EAN 9786138836193 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. …

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Due to rapid research in the electronics industry, including a dramatic increase in chip densities and power densities, as well as a continuous decrease in physical dimensions of electronic packages, thermal management is, and will continue to be, one of the most critical areas in electronic product development. It will have a significant impact on the cost, overall design, reliability and performance. The present trend in the electronics industry is to reduce the size and increase the performance of the equipment. The cooling rate of the modern electronic component is one of the prime areas for the application of thermal control techniques. In the present book, the effect of various shapes of cross sections of fins on the motherboard is studied keeping the inlet air velocity, the temperature of the ambient and the heat generation constant. Finite Element Analysis is done to get heat transfer and temperature distribution. This book will be useful for researchers doing research on computational heat transfer specifically for the electronics industry. 60 pp. Englisch. …

Condición: New. Print on Demand.

Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Due to rapid research in the electronics industry, including a dramatic increase in chip densities and power densities, as well as a continuous decrease in physical dimensions of electronic packages, thermal management is, and will continue to be, one of the most critical areas in electronic product development. It will have a significant impact on the cost, overall design, reliability and performance. The present trend in the electronics industry is to reduce the size and increase the performance of the equipment. The cooling rate of the modern electronic component is one of the prime areas for the application of thermal control techniques. In the present book, the effect of various shapes of cross sections of fins on the motherboard is studied keeping the inlet air velocity, the temperature of the ambient and the heat generation constant. Finite Element Analysis is done to get heat transfer and temperature distribution. This book will be useful for researchers doing research on computational heat transfer specifically for the electronics industry.…

Condición: New. PRINT ON DEMAND.

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Sharma SahilSahil Sharma is a Graduate Mechanical Engineer of ITM Universe, Vadodara, Gujarat, India. Dr. Nirajkumar Mehta is an Associate Professor at ITM Universe, Vadodara, Gujarat, India. Prof. Jay Mandalia is Head of Mechanical . …

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Due to rapid research in the electronics industry, including a dramatic increase in chip densities and power densities, as well as a continuous decrease in physical dimensions of electronic packages, thermal management is, and will continue to be, one of the most critical areas in electronic product development. It will have a significant impact on the cost, overall design, reliability and performance. The present trend in the electronics industry is to reduce the size and increase the performance of the equipment. The cooling rate of the modern electronic component is one of the prime areas for the application of thermal control techniques. In the present book, the effect of various shapes of cross sections of fins on the motherboard is studied keeping the inlet air velocity, the temperature of the ambient and the heat generation constant. Finite Element Analysis is done to get heat transfer and temperature distribution. This book will be useful for researchers doing research on computational heat transfer specifically for the electronics industry.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 60 pp. Englisch. …