ISBN: 9781527896680 - dielectric and conductor-loss characterization and measurements on electronic packaging materials (classic reprint) (5 resultados)

- Tapa blanda
Librería: PBShop.store US, Wood Dale, IL, Estados Unidos de AmericaPBShop.store US
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 28,34
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: 15 disponibles
PAP. Condición: New. New Book. Shipped from UK. Established seller since 2000.

- Tapa blanda
Librería: Books Puddle, Woodside, NY, Estados Unidos de AmericaBooks Puddle
Contactar con el vendedorVendedor de 4 estrellasCondición: Nuevo
EUR 26,20
Envío por EUR 3,58Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponible
Condición: New.

- Tapa blanda
Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books
Contactar con el vendedorVendedor de 4 estrellasCondición: Nuevo
EUR 22,10
Envío por EUR 7,80Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponible
Condición: New.

- Tapa blanda
Librería: PBShop.store UK, Fairford, GLOS, Reino UnidoPBShop.store UK
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 26,96
Envío por EUR 4,99Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 15 disponibles
PAP. Condición: New. New Book. Shipped from UK. Established seller since 2000.
Más imágenes- Tapa blanda
- Impresión bajo demanda
Librería: Forgotten Books, London, Reino UnidoForgotten Books
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 17,87
Gastos de envío gratisSe envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Paperback. Condición: New. Print on Demand. This book provides an overview of dielectric measurement methods and metrology on substrate materials used in electronic packaging. These substrates include low and high temperature co-fired ceramic substrates, printed wiring boards, and other packaging materials. Most commonly used methods are presented, with particular emphasis on methods that can be used nondestructively either in the laboratory or on the assembly line. The author begins with an overview of pertinent electrical properties of substrate materials and conductors, with a review of the relevant parameters of transmission line theory. Methods for thin materials permittivity measurement are reviewed, as are metal losses in various transmission-line structures. The book discusses cavity and dielectric resonators, full-sheet resonance, coaxial probe, stripline, and capacitive methods. The frequency ranges of applicability and typical uncertainties associated with the methods are summarized. Measurement results for a number of commonly used materials are presented. Thermal properties are overviewed and a technique for measurements at elevated temperatures is given. Measurement results for several commonly used materials are given. This book will be of interest to researchers, technologists, and engineers involved in the design, fabrication, and testing of electronic packaging and interconnects. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item.…