Librería: Romtrade Corp., STERLING HEIGHTS, MI, Estados Unidos de America
EUR 136,48
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Librería: Basi6 International, Irving, TX, Estados Unidos de America
EUR 137,57
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 166,20
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 178,30
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Used. pp. 360.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 183,34
Cantidad disponible: 15 disponibles
Añadir al carritoCondición: New.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 189,63
Cantidad disponible: 15 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
EUR 185,00
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Used. pp. 360 Illus.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 187,45
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Used. pp. 360.
Idioma: Inglés
Publicado por Kluwer Academic Publishers, 2003
ISBN 10: 1402017650 ISBN 13: 9781402017650
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 198,21
Cantidad disponible: 15 disponibles
Añadir al carritoCondición: New. The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinary teaching perspective. Num Pages: 355 pages, 248 black & white illustrations, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 774. . 2003. Hardback. . . . .
Librería: moluna, Greven, Alemania
EUR 178,14
Cantidad disponible: Más de 20 disponibles
Añadir al carritoGebunden. Condición: New. Knowledge itself is soon obsolete It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated ab.
Idioma: Inglés
Publicado por Kluwer Academic Publishers, 2003
ISBN 10: 1402017650 ISBN 13: 9781402017650
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
EUR 251,98
Cantidad disponible: 15 disponibles
Añadir al carritoCondición: New. The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book addresses the situation from a multidisciplinary teaching perspective. Num Pages: 355 pages, 248 black & white illustrations, biography. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 20. Weight in Grams: 774. . 2003. Hardback. . . . . Books ship from the US and Ireland.
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 247,94
Cantidad disponible: 2 disponibles
Añadir al carritoBuch. Condición: Neu. Neuware - Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.