9780803104037 - semiconductor processing: a symposium (astm special technical publication) (3 resultados)
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Librería: Zubal-Books, Since 1961, Cleveland, Estados Unidos de AmericaZubal-Books, Since 1961
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Bueno
EUR 25,51
Envío por EUR 3,90Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Condición: Very Good. 671 pp., hardcover, spine faded else text clean & binding tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
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Librería: HPB-Diamond, Dallas, Estados Unidos de AmericaHPB-Diamond
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Bueno
EUR 26,79
Envío por EUR 3,25Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
hardcover. Condición: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority.
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- Primera edición
Librería: 100POCKETS, Berkeley, Estados Unidos de America100POCKETS
Contactar con el vendedorVendedor de 4 estrellasCondición: Nuevo
EUR 34,40
Envío por EUR 6,51Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: New. Estado de la sobrecubierta: None as Issued. First Edition. First Thus. Text/BRAND NEW & Bright First Edition, First Thus. Illustrated blue boards/NF; rub to lower back corner tip & light shelfwear. DJ/None as Issued. Papers presented at the 3rd ASTM Symposium on Semiconductor Processing, San Jose, Feb…7 - 10, 1984. Special Technical Publication 850. 671 pgs in 7 sections: 1, Standards in Semiconductor Industry; 2, Fabrication Technology; 3, Control of Particulate Contamination; 4, Defects & Gettering Techniques; 5, Material & Process Characterization; 6, Interconnection Technology: Wire & Tape Bonding; 7, Neutron Transmutation Doping Techniques & Facilities, followed by 3 appendices. Fine copy.
