Isbn: 9780444425607 - micromachining and micropackaging of transducers (studies in electrical and electronic engineering) (2 resultados)
Micromachining and Micropackaging of Transducers (STUDIES IN ELECTRICAL AND ELECTRONIC ENGINEERING)
Fung, C. D.; Cheung, Peter W.; Ko, Wen H.; Fleming, David G.
- Tapa dura
Librería: -OnTimeBooks-, Phoenix, AZ, Estados Unidos de America-OnTimeBooks-
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Aceptable
EUR 40,21
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponible
Condición: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…
Micromachining and Micropackaging of Transducers (Studies in Electrical and Electronic Engineering)
C. D. Fung And Peter W. Cheung And Wen H. Ko And David G. Fleming
- Tapa dura
Librería: David's Books, ypsilanti, MI, Estados Unidos de AmericaDavid's Books
Contactar con el vendedorVendedor de 2 estrellasCondición: Usado - Regular
EUR 36,35
Envío por EUR 4,78Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponible
Hardcover. Condición: Fair. Estado de la sobrecubierta: No Dust Jacket As Issued. Library pocket and spine tape, cover nicked top of spine ; Ex-Library.
