Meuris marc (21 resultados)

Condición: New.

Paperback. Condición: New.

Condición: New. In English.

Condición: New.

Softcover/Paperback. Condición: Sehr gut. 400 p. Very good. Shrink wrapped. / Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 760.

Condición: New. pp. 176.

Condición: New.

Paperback. Condición: Wie neu. 1st ed. 412 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 825.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.…

Condición: gut. 2008. Ultra Clean Processing of Semiconductor Surfaces VIII. (=Solid State Phenomena ; 134). In deutscher Sprache. pages.

Condición: gut. 2009. Ultra Clean Processing of Semicounductor Surfaces IX. (=Solid State Phenomena; Vols. 145-146). In deutscher Sprache. pages.

Paperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Paperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

2. Bruxelles, Editions Labor, Editions Isy Brachot, 1992, in-4°, 143 pp, coloured ills., publisher's cased binding with an illustrated dust jacket. Text in French but with translations in English, German and Dutch.

3. Bruxelles, Editions Labor, Editions Isy Brachot, 1992, in-4°, 143 pp, coloured ills., publisher's cased binding with an illustrated dust jacket. Text in French but with translations in English, German and Dutch.

Paperback / softback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.

Condición: New. Print on Demand pp. 176.

Condición: New. PRINT ON DEMAND pp. 176.

Paperback. Condición: new. Paperback. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. …

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental p.…

Taschenbuch. Condición: Neu. Chemical-Mechanical Polishing 2000 Fundamentals and Materials Issues | Volume 613 | Rajiv K. Singh (u. a.) | Taschenbuch | Kartoniert / Broschiert | Englisch | 2013 | Cambridge University Press | EAN 9781107413146 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand. …