EUR 6,75
Cantidad disponible: 1 disponibles
Añadir al carritoCloth. Condición: Very Good. 315 pp. Tightly bound. Corners not bumped. Text is free of markings. NOTE: EX-LIBRARY copy.
Librería: Alplaus Books, Alplaus, NY, Estados Unidos de America
EUR 6,73
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: Good. Organizational stampings inside cover. Hinges becoming visible inside front and back. No markings of text noted; modest wear.
Idioma: Inglés
Publicado por Institute of Electrical and Electronics Engineers Press, 1993, 1993
ISBN 10: 0780304071 ISBN 13: 9780780304079
Librería: Virginia Martin, aka bookwitch, Concord, CA, Estados Unidos de America
EUR 33,96
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Fine. No Jacket. Small quarto, hardcover, fine in red boards. No dj. Illustrated by B & W drawings & photos. translated, preeminent articles from the Journal "Surface Mount Technology", published in Japanese. Translated by TechSearch International. 315 pp. including index. Giftable. Discusses trends in surface mount tech, SMT equipment, solder tech., tape automated bonding, chip on board, multichip modules and printed circuit board tech., etc. Book.
Librería: Basi6 International, Irving, TX, Estados Unidos de America
EUR 56,72
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Librería: Romtrade Corp., STERLING HEIGHTS, MI, Estados Unidos de America
EUR 56,72
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
EUR 65,10
Cantidad disponible: 1 disponibles
Añadir al carritoBrand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.