VLSI-SoC: Technologies for Systems Integration: 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, ... and Communication Technology, 360). Este artículo no está disponible.
Idioma: inglés
Editorial: Springer, 2011
- Tapa dura
- Nuevo

Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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Descripción del artículo del vendedor
In English.
N° de ref. del artículo ria9783642231193_new
- Título
- VLSI-SoC: Technologies for Systems Integration: 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, ... and Communication Technology, 360)
- Editorial
- Springer
- Año de publicación
- 2011
- Estado
- New
- Encuadernación
- Encuadernación de tapa dura
- Idioma
- inglés
- ISBN 10
- 3642231195
- ISBN 13
- 9783642231193
- Peso del artículo
- 596 gramos
This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
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De la contraportada
This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
“Acerca de” puede pertenecer a otra edición de este título.
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