Thin Film Encapsulation of Radio Frequency Microelectromechanical Systems Switches

Idioma: inglés

Editorial: Creative Media Partners, LLC Mai 2025, 2025

1025130138 / 9781025130132

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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH

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Vendedor de IberLibro desde 14 de agosto de 2006

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Descripción del artículo del vendedor

Neuware - Microelectromechanical systems (MEMS) radio frequency (RF) switches have been shown to have excellent electrical performance over a wide range of frequencies. However, cost-effective packaging techniques for MEMS switches do not currently exist. This thesis involves the design of RF-optimized encapsulations consisting of dielectric and metal layers, and the creation of a novel thin film encapsulation process to fabricate the encapsulations. The RF performance of several encapsulation designs are evaluated wit h an analytical model, full wave electromagnetic simulation, and laboratory testing. Performance degradation due to parasitic and reflection losses due to the package is considered, and RF feed-throughs of the transmission line into and out of the package are designed and assessed. Ten different encapsulation designs were created and their RF performance was characterized in terms of insertion loss, return loss, and isolation. A switch without an encapsulation and a switch with a dielectric encapsulation were fabricated and tested by the Air Force Research Laboratory (AFRL), and the test data was used to verify the data from analytical modeling and electromagnetic simulation performed in this work.This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work was reproduced from the original artifact, and remains as true to the original work as possible. Therefore, you will see the original copyright references, library stamps (as most of these works have been housed in our most important libraries around the world), and other notations in the work.This work is in the public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work.As a reproduction of a historical artifact, this work may contain missing or blurred pages, poor pictures, errant marks, etc. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.…

N° de ref. del artículo 9781025130132

Título
Thin Film Encapsulation of Radio Frequency Microelectromechanical Systems Switches
Autor
Eric D Marsh
Editorial
Creative Media Partners, LLC Mai 2025
Año de publicación
2025
Estado
Neu
Encuadernación
Taschenbuch
Idioma
inglés
ISBN 10
1025130138
ISBN 13
9781025130132
Peso del artículo
245 gramos
Dimensiones
234x156x9 mm

AHA-BUCH GmbH

Einbeck, Alemania

Vendedor de 5 estrellas

Vendedor de IberLibro desde 14 de agosto de 2006

Tarifas de envío de Alemania a Estados Unidos de America

ArtículoDe 7 a 10 días hábilesDe 5 a 7 días hábiles
Primer artículoEUR 35,00EUR 45,00
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Información empresarial del vendedor

AHA-BUCH GmbH

Garlebsen 48
Einbeck, Alemania 37574