Reconfigurable Intelligent Surfaces for Wireless Communications: Modeling, Architectures, and Applications

This book provides a comprehensive overview of the emerging technology of reconfigurable intelligent surfaces for wireless communications, detailing the latest advances in their hardware architectures and modes of operations, ranging from metasurface-based smart reflectors and extremely large multi-antenna transceivers, as well as multi-functional metasurfaces, along with their realistic modeling and the state-of-the-art advanced signal processing and machine learning approaches for their operation optimization. It also covers the rapidly evolving topics of beyond diagonal and transmissive reconfigurable intelligent surfaces, stacked intelligent metasurfaces, as well as dynamic metasurface antennas and holographic MIMO that have lately produced numerous research activities and relevant literature. The book also covers various applications of reconfigurable intelligent surfaces, including multi-user and near-field communications, electromagnetic imaging and sensing, over-the-air computation, physical-layer security, simultaneous wireless information and power transfer, as well as integrated sensing and communications. The current status and future directions on the book's core technology in relevant activities in standardization are also discussed.

George C. Alexandropoulos (Senior Member, IEEE) received the Engineering Diploma, M.A.Sc., and Ph.D. degrees in Computer Engineering and Informatics from the University of Patras, Greece in 2003, 2005, and 2010, respectively. He has served as a Senior Research Engineer and a Principal Researcher at the Mathematical and Algorithmic Sciences Lab, Huawei Technologies France and at the Technology Innovation Institute, United Arab Emirates, respectively. He is currently an Associate Professor with the Department of Informatics and Telecommunications, National and Kapodistrian University of Athens, Greece and an Adjunct Professor with the Department of Electrical and Computer Engineering, University of Illinois Chicago, USA. His research interests span the general areas of algorithmic design and performance analysis for wireless networks with emphasis on reconfigurable intelligent surfaces, full duplex MIMO, as well as integrated sensing and communications.

Alessio Zappone (Fellow, IEEE) received his M.Sc. and Ph.D. both from the University of Cassino and Southern Lazio (Cassino, Italy). In 2012, he worked with the Consorzio Nazionale Interuniversitario per le Telecomunicazioni, while from 2012 to 2016, he has been with the Dresden University of Technology. In 2017, he was with the LANEAS group of CentraleSupélec, Paris-Saclay University, Paris, France. Since 2019, he is a professor at the University of Cassino and Southern Lazio. His research interests lie in the area of communication theory and signal processing, with main focus on optimization techniques for resource allocation and energy efficiency maximization.

Nir Shlezinger (Senior Member, IEEE) is an assistant professor in the School of Electrical and Computer Engineering in Ben-Gurion University, Israel. He received his B.Sc., M.Sc., and Ph.D. degrees in 2011, 2013, and 2017, respectively, from Ben-Gurion University, Israel. From 2017 to 2019 he was a postdoctoral researcher in the Technion, and from 2019 to 2020 he was a postdoctoral researcher in Weizmann Institute of Science. His research interests include signal processing, machine learning, and communications.

Marco Di Renzo (Fellow, IEEE) received the Laurea and Ph.D. degrees in Electrical Engineering from the University of L’Aquila, Italy, in 2003 and 2007, respectively, and the Habilitation à Diriger des Recherches degree from the Paris-Saclay University, France, in 2013. Currently, he is a CNRS Research Director (Professor) and the head of the Intelligent Physical Communications group at CNRS & CentraleSupélec, Paris-Saclay University, France, as well as a Chair Professor in Telecommunications Engineering with the Centre for Telecommunications Research, Department of Engineering, King’s College London, London, United Kingdom.