Processing Technology of Brittle Crystal Materials. Este artículo no está disponible.
Idioma: inglés
Editorial: Mdpi AG, 2023
- Tapa dura
- Nuevo

Librería: Rarewaves USA, HEBRON, KY, Estados Unidos de AmericaRarewaves USA
Vendedor de IberLibro desde 10 de junio de 2025
Condición: Nuevo
EUR 66,21
N° de ref. del artículo LU-9783036588667
- Título
- Processing Technology of Brittle Crystal Materials
- Autor
- Chen Li, Chongjun Wu, Binbin Meng
- Editorial
- Mdpi AG
- Año de publicación
- 2023
- Estado
- New
- Encuadernación
- Hardback
- Idioma
- inglés
- ISBN 10
- 3036588663
- ISBN 13
- 9783036588667
- Peso del artículo
- 644 gramos
- Dimensiones
- 16.99 x 1.75 x 24.41 cm
In this reprint, the mechanical properties and material removal behaviors of brittle crystals and ceramics are evaluated using the nanoindentation and scratch tests. Some advanced processing technologies oforf brittle crystals, ceramics, and composite materials are proposed, such as precision grinding, rotary ultrasonic milling and drilling, continuous polishing, thermal-controlled fracture cutting, laser processing, abrasive flow machining, and the additive manufacturing process. In addition, the relationship between the critical cutting depth and the maximum undeformed chip thickness on the removal mode of brittle materials is analyzed. The theoretical models of grinding force and surface generation are developed by considering the brittle-to-ductile transition, arc-shaped effect, and synchronous vibration of the wheel. These advanced theoretical models and processing methods effectively improve the surface integrity of the workpiece and machining efficiency, and reduced the cutting force and tool wear.
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