Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, . December 12-15, 1999, Paris, France (EEP). Este artículo no está disponible.
Idioma: inglés
Editorial: American Society of Mechanical Engineers, 2000
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N° de ref. del artículo ERICA796079181663X6
- Título
- Proceedings of the 1999 Workshop on Polymeric Materials for Microelectronics and Photonics Applications, Mechanics, Physics, Reliability, Processing, . December 12-15, 1999, Paris, France (EEP)
- Autor
- American Society Of Mechanical Engineers
- Editorial
- American Society of Mechanical Engineers
- Año de publicación
- 2000
- Estado
- Like New
- Tipo de libro
- book
- Encuadernación
- Paperback
- Idioma
- inglés
- ISBN 10
- 079181663X
- ISBN 13
- 9780791816639
Reseña del editor
The 33 papers from the December 1999 workshop report on current knowledge in the field of mechanics, physics and reliability of polymers, particularly those used in plastic packages of integrated circuit (IC) devices. Topics include fracture and damage investigations enhancing the thermo-mechanical reliability of plastic packages, the effect of polymer material properties on wire bonding to MCMs and advanced copper-low-K ICs, evaluation of the moisture sensitivity of molding compounds of IC packages, the influence of visco-elastic polymeric materials on flexural vibrations, application of the probabilistic approach in thermal stress modeling of packaging, and fiber optic sensor evaluation of epoxy-cured fiber optic connectors. No subject index.
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