Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling

Idioma: inglés

Editorial: Springer, 2012

1461410525 / 9781461410522

Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH

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Descripción del artículo del vendedor

Druck auf Anfrage Neuware - Printed after ordering - Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also:Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSPProvides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrationsPresents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designsPower Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices.…

N° de ref. del artículo 9781461410522

Título
Power Electronic Packaging : Design, Assembly Process, Reliability and Modeling
Autor
Yong Liu
Editorial
Springer
Año de publicación
2012
Estado
Neu
Encuadernación
Buch
Idioma
inglés
ISBN 10
1461410525
ISBN 13
9781461410522
Peso del artículo
1074 gramos
Dimensiones
241x160x39 mm

AHA-BUCH GmbH

Einbeck, Alemania

Vendedor de 5 estrellas

Vendedor de IberLibro desde 14 de agosto de 2006

Tarifas de envío de Alemania a Estados Unidos de America

ArtículoDe 7 a 10 días hábilesDe 5 a 7 días hábiles
Primer artículoEUR 42,52EUR 57,89
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Información empresarial del vendedor

AHA-BUCH GmbH

Garlebsen 48
Einbeck, Alemania 37574