From LED to Solid State Lighting
Idioma: inglés
Editorial: John Wiley and Sons Inc, US, 2021
- Tapa dura
- Nuevo

Librería: Rarewaves.com UK, London, Reino UnidoRarewaves.com UK
Vendedor de IberLibro desde 11 de junio de 2025
Condición: Nuevo
EUR 140,01
Cantidad disponible: 6 disponibles
Añadir al carritoDescripción del artículo del vendedor
FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They'll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chipsPractical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterizationComprehensive explorations of board-level assembly and LED modules and optical and electrical characterizationIn-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.…
N° de ref. del artículo LU-9781118881477
- Título
- From LED to Solid State Lighting
- Autor
- S. W. Ricky Lee, Huaiyu Ye, Mian Tao, Jeffery C. C. Lo
- Editorial
- John Wiley and Sons Inc, US
- Año de publicación
- 2021
- Estado
- New
- Encuadernación
- Hardback
- Idioma
- inglés
- ISBN 10
- 1118881478
- ISBN 13
- 9781118881477
- Peso del artículo
- 600 gramos
A comprehensive and practical reference complete with hands-on exercises and experimental data
In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features.
Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material.
This important book also includes:
- Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips
- Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization
- Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization
- In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting
Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
“Sinopsis” puede pertenecer a otra edición de este título.
Acerca del autor
Shi-Wei Ricky Lee, PhD, received his PhD degree in Aeronautical & Astronautical Engineering from Purdue University in 1992. Currently he is Chair Professor of Mechanical and Aerospace Engineering and Director of Foshan Research Institute for Smart Manufacturing at the Hong Kong University of Science and Technology (HKUST).
Jeffery C. C. Lo, PhD, received his Bachelor (1st Class Honour) and MPhil degrees in Mechanical Engineering from the Hong Kong University of Science and Technology (HKUST) in 2002 and 2004 respectively. He is currently the Program Manager at the Center for Advanced Microsystems Packaging at HKUST and Assistant Director of FRISM.
Mian Tao, PhD, received his MSc degree from the Hong Kong University of Science and Technology (HKUST) in Mechanical Engineering in 2010 and PhD degree in 2016. His research interests include thermal characterization and management of high power electronics and development of advanced microelectronic packages.
Huaiyu Ye, PhD, received his PhD degree from the Department of Microelectronics, Delft University of Technology in 2014. Currently he is Associate Professor of Southern University of Science and Technology (SUSTech).
“Acerca de” puede pertenecer a otra edición de este título.
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Vendedor de IberLibro desde 11 de junio de 2025
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