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Hardcover. This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemunde (Baltic Sea), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. Interconnects in VLSI Design addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense Interconnects in VLSI Design represents a continuation and a supplement to the first book, Signal Propagation on Interconnects, Kluwer Academic Publishers, 1998. The papers in Interconnects in VLSI Design cover a wide area of research directions. Apart from describing general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last, but not least, actual problems in the field of optical interconnects. This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. N° de ref. del artículo 9780792379973
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
Reseña del editor: This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
Título: Interconnects in VLSI Design (Hardcover)
Editorial: Kluwer Academic Publishers, Dordrecht
Año de publicación: 2000
Encuadernación: Hardcover
Condición: new
Librería: PsychoBabel & Skoob Books, Didcot, Reino Unido
Hardcover. Condición: Very Good. Estado de la sobrecubierta: No Dust Jacket. First Edition. Hard cover with printed boards, no jacket; Cover shows hardly noticable storage wear. Previous owner's name on FEP. Contents are otherwise clean, bright and tight. J. Used. Nº de ref. del artículo: 248522
Cantidad disponible: 1 disponibles
Librería: Buchpark, Trebbin, Alemania
Condición: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher. Nº de ref. del artículo: 2354657/3
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Librería: moluna, Greven, Alemania
Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neusta. Nº de ref. del artículo: 5970594
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Librería: preigu, Osnabrück, Alemania
Buch. Condición: Neu. Interconnects in VLSI Design | Hartmut Grabinski | Buch | vii | Englisch | 2000 | Springer US | EAN 9780792379973 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Nº de ref. del artículo: 102549385
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Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
Condición: New. Nº de ref. del artículo: ABLIING23Feb2416190184938
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
Buch. Condición: Neu. Neuware -This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch. Nº de ref. del artículo: 9780792379973
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects. 248 pp. Englisch. Nº de ref. del artículo: 9780792379973
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Librería: Ria Christie Collections, Uxbridge, Reino Unido
Condición: New. In. Nº de ref. del artículo: ria9780792379973_new
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Librería: AHA-BUCH GmbH, Einbeck, Alemania
Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects. Nº de ref. del artículo: 9780792379973
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Librería: Books Puddle, New York, NY, Estados Unidos de America
Condición: New. pp. 248. Nº de ref. del artículo: 26321391
Cantidad disponible: 4 disponibles